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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Burack, J.J. LeGrange, J.D. Lin, A.W. |
| Copyright Year | 1989 |
| Description | Author affiliation: AT&T Bell Labs., Princeton, NJ, USA (Burack, J.J.; LeGrange, J.D.) |
| Abstract | Thin films of polyimide that exhibit enhanced resistance to moisture, fabricated using the Langmuir-Blodgett (LB) technique, are discussed. The adhesion strength of both LB and spin-coated films of several different polyimides, deposited on fused silica, has been measured by subjecting the films to steam or water, followed by a tape test, and monitoring changes in their ultraviolet spectra. The results demonstrate that LB films adhere better to fused silica than the spin-coated films. Measurements of the rate of water vapor transmission through Kapton sheet coated by a monolayer of any of the polyimides show that a monolayer forms a moisture barrier. On the basis of these results the electrical performance of polyimide films has been tested at 85 degrees C and 85% humidity by measuring leakage current between conducting paths under 180-V bias, using samples coated with various combinations of LB and spin-coated films. Composite films consisting of a LB monolayer either underneath or on top of a thick, spin-coated film exhibit superior electrical performance to either type of film by itself.< |
| Starting Page | 143 |
| Ending Page | 147 |
| File Size | 454136 |
| Page Count | 5 |
| File Format | |
| DOI | 10.1109/ECC.1989.77740 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1969-05-22 |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Moisture Protection Polyimides Silicon compounds Testing Conductive films Transistors Adhesives Electrical resistance measurement Monitoring |
| Content Type | Text |
| Resource Type | Article |
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