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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | McKenna, R.G. Mahle, R.L. |
| Copyright Year | 1989 |
| Description | Author affiliation: Texas Instrum. Inc., Houston, TX, USA (McKenna, R.G.; Mahle, R.L.) |
| Abstract | Tests performed to determine the critical thermosonic bond parameters and their impact on gold-wire ball bond reliability in large, high-pin-count, plastic-encapsulated integrated circuits are discussed. Bond-pad cratering, lifted metal, and lifted balls are recognized as a serious quality problem in the industry, resulting in assembly yield loss as well as potential reliability problems. It has been found that the strength of the silicon dioxide structure beneath the bond pads is greater for short-duration dynamic forces than for static force. The application of much higher bond forces during ball touchdown, combined with a reduction of static mash force, was found to reduce damage to the subsurface structure and improve reliability of ICs known to be sensitive to cratering problems.< |
| Starting Page | 424 |
| Ending Page | 427 |
| File Size | 485737 |
| Page Count | 4 |
| File Format | |
| DOI | 10.1109/ECC.1989.77784 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1969-05-22 |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Very large scale integration Plastics Integrated circuit reliability Circuit testing Bonding forces Integrated circuit testing Performance evaluation Metals industry Assembly Integrated circuit yield |
| Content Type | Text |
| Resource Type | Article |
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