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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Burack, J.J. LeGrange, J.D. Lin, A.W. |
| Copyright Year | 1978 |
| Abstract | Thin films of polyimide which exhibit enhanced resistance to moisture have been fabricated using the Langmuir-Blodgett (LB) technique. LB films are ultrathin organic coatings of thicknesses ranging from tens of angstroms to a micrometer, characterized by high molecular density and a high degree of structural order. The adhesion strength of both LB and spin-coated films of several different polyimides, deposited on fused silica, has been measured by subjecting these films to steam or water, followed by a tape test, and monitoring changes in their UV spectra. The results demonstrate that LB films of polyimide adhere better to fused silica than the spin-coated films. In addition, measurements of water vapor transmission rate through Kapton sheet coated by a monolayer of any of the polyimides show that a monolayer forms a moisture barrier, decreasing the water vapor transmission through the Kapton. Based on these results, the electrical performance of polyimide films has been tested at 85 degrees C, 85% humidity, by measuring leakage current between conducting paths under 180-V bias, on samples which are coated with various combinations of LB and spin-coated polyimide films. Composite films of polyimide consisting of an LB monolayer either underneath or on top of a thick, spin-coated film exhibit superior electrical performance to either a spin-coated or LB film by itself. This may be explained by the improved adhesion and/or decreased water permeability of polyimide LB films.< |
| Sponsorship | IEEE Electronic Industries Alliance American Society of Mechanical Engineering (ASME) NBS SAE |
| Starting Page | 214 |
| Ending Page | 218 |
| Page Count | 5 |
| File Size | 473661 |
| File Format | |
| ISSN | 01486411 |
| Volume Number | 13 |
| Issue Number | 1 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1990-03-01 |
| Publisher Place | U.S.A. |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Moisture Protection Polyimides Adhesives Silicon compounds Testing Conductive films Transistors Coatings Monitoring |
| Content Type | Text |
| Resource Type | Article |
| Subject | Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Engineering Electrical and Electronic Engineering |
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