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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Yoshioka, O. Okabe, N. Nagayama, S. Yamagishi, R. Murakami, G. |
| Copyright Year | 1989 |
| Description | Author affiliation: Hitachi Cable Ltd., Ibaraki, Japan (Yoshioka, O.; Okabe, N.; Nagayama, S.; Yamagishi, R.) |
| Abstract | In recent years, the demand for copper alloy lead-frame materials has been rising. This is due to deterioration of the reliability of plastic-encapsulated ICs because of larger chip size and increased heat generation from more densely integrated chips. However, copper alloys may form a thick, brittle oxide film on the surface as a result of heating during packaging, thus reducing moisture resistance. The surface finishing process for copper alloy lead-frame materials was studied to overcome this problem. It became evident that the improvement of adhesion to resin is effective in preventing the penetration of moisture into the package. This resulted in the development of an Sn-Ni-plated copper lead frame that enhances the moisture resistance.< |
| Starting Page | 464 |
| Ending Page | 471 |
| File Size | 502717 |
| Page Count | 8 |
| File Format | |
| DOI | 10.1109/ECC.1989.77790 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1969-05-22 |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Moisture Plastics Copper alloys Surface resistance Lead Packaging Resistance heating Surface finishing Adhesives Resins |
| Content Type | Text |
| Resource Type | Article |
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