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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Kanzaki, K. Taguchi, M. Sasaki, G. Furukawa, A. Aoki, K. Tokumaru, Y. Nakai, M. Ikeda, M. |
| Copyright Year | 1979 |
| Description | Author affiliation: Toshiba Corporation (Kanzaki, K.) |
| Abstract | A new technology for realizing high performance $I^{2}L$ and high speed ECL circuits on a same chip is described. The key to such a technology is graft base structure having respectively optimized impurity profiles for $I^{2}L$ gates and linear transistors. All of base regions $(I^{2}L;$ $P^{+},$ $P^{--},$ a linear transistor; $P^{++},$ $P^{-})$ are formed in different doping steps, followed by only one $n^{+}diffusion$ for $I^{2}L$ collector and the linear transistor's emitter. $I^{2}L$ $P^{--}intrinsic$ base region formed by high energy ion implantation has a smaller Gummel number and a deeper junction depth than in the linear transistor. $I^{2}L$ $P^{+}extrinsic$ base region is deeper in junction depth than linear $P^{++}base$ region. A high speed $I^{2}L$ gate with upward current gain of 30 and 7 ns minimum delay could be compatible with a linear transistor having downward current gain of 80, BVCEOof 18 V and 4 GHz maximum cut off frequency. Futhermore, an ECL divider has successfully operated at frequencies up to 1.4 GHz. |
| Starting Page | 328 |
| Ending Page | 331 |
| File Size | 376045 |
| Page Count | 4 |
| File Format | |
| DOI | 10.1109/IEDM.1979.189616 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1979-12-03 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Circuits Doping Frequency Logic Large scale integration Inverters Semiconductor devices Laboratories Semiconductor impurities Delay |
| Content Type | Text |
| Resource Type | Article |
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