NDLI: Rethinking thermal via planning with timing-power-temperature dependence for 3D ICs

Content Provider	IEEE Xplore Digital Library
Author	Kan Wang Yuchun Ma Sheqin Dong Yu Wang Xianlong Hong Cong, J.
Copyright Year	2011
Description	Author affiliation: Dept. of Electronic Engineering, Tsinghua University, Beijing, China, 100084 (Yu Wang) \|\| Dept. of Computer Science, UCLA, Los Angeles, CA, 90095 (Cong, J.) \|\| Dept. of Computer Science and Technology, Tsinghua University, TNList (Kan Wang; Yuchun Ma; Sheqin Dong; Xianlong Hong)
Abstract	Due to the increased power density and lower thermal conductivity, 3D is faced with heat dissipation and temperature problem seriously. Previous researches show that leakage power and delay are both relevant to temperature. The timing-power-temperature dependence will potentially negate the performance improvement of 3D designs. TSV (Through-Silicon-Vias) has been shown as an effective way to help heat removal, but they create routing congestions. Therefore, how to reach the trade-off between temperature, via number and delay is required to be solved. Different from previous works on TSV planning which ignored the effects of leakage power, in this paper, we integrate temperature-leakage-timing dependence into thermal via planning of 3D ICs. A weighted via insertion approach, considering both performance and heat dissipation with resource constraint, is proposed to achieve the best balance among delay, via number and temperature. Experiment results show that, with leakage power and resource constraint considered the temperature and via number required can be quite different, and weighted TSV insertion approach can improve thermal via number, by about 5.6%.
Starting Page	261
Ending Page	266
File Size	972749
Page Count	6
File Format	PDF
ISBN	9781424475155
ISSN	21536961
e-ISBN	9781424475162
DOI	10.1109/ASPDAC.2011.5722195
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-01-25
Publisher Place	Japan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Delay Planning Through-silicon vias Temperature dependence Heating Tiles Three dimensional displays
Content Type	Text
Resource Type	Article

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