NDLI: Analysis of TSV geometric parameter impact on switching noise in 3D power distribution network

Content Provider	IEEE Xplore Digital Library
Author	Huanyu He Lu, J.J.-Q. Xiaoxiong Gu
Copyright Year	2014
Description	Author affiliation: IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA (Xiaoxiong Gu) \|\| Dept. of Electr., Comput. & Syst. Eng., Rensselaer Polytech. Inst. Troy, Troy, NY, USA (Huanyu He; Lu, J.J.-Q.)
Abstract	This paper reports on modeling of simultaneous switching noise (SSN) in 3D TSV-based system with multiple IC chips stacked and connected through TSVs. TSVs and other components are modeled using full-wave electromagnetic tools to extract equivalent circuit models. Power distribution network (PDN) combining on-chip and off-chip components are simulated with SPICE. The voltage noise generated by switching current is analyzed to exanimate the impact of TSV geometric parameters such as TSV dimensions, pitch, and number. The current noise in TSV is also extracted for the potential impact on signal integrity. The impacts of TSV geometric parameters on the PDN noise are limited impacts at frequencies below 1 GHz. However, the frequencies of inter-chip resonances are sensitive to TSV geometric parameters. These resonant frequencies are often in the range of 1 GHz - 10 GHz, which may coincide with the clock frequency and induce significant noises.
Sponsorship	IEEE Electron Dev. Soc.
Starting Page	67
Ending Page	72
File Size	1157345
Page Count	6
File Format	PDF
ISBN	9781479939442
DOI	10.1109/ASMC.2014.6846979
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2014-05-19
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Through-silicon vias Noise Resonant frequency Impedance System-on-chip Switches Integrated circuit modeling di/dt noise 3D integration through-silicon via (TSV) 3D/TSV modeling 3D Power delivery IR drop
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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