NDLI: Rethinking the approach to higher 450mm process gas flows: A case study

Content Provider	IEEE Xplore Digital Library
Author	Corbin, B. Pierce, A. Bailey, C.
Copyright Year	2014
Description	Author affiliation: IBM Assignee, Albany, NY, USA (Corbin, B.) \|\| Edwards Vacuum, USA (Pierce, A.; Bailey, C.)
Abstract	The impending increase in silicon wafer diameter from 300mm (the current industry norm) to 450mm will increase the surface area of each wafer by 2.25 times. A worst-case scenario suggests that flammable process gas flow rates required to maintain wafer throughput at acceptable levels would increase by the same scaling factor driving up to 3 times the abatement requirement. The main reason to go to a 450mm wafer size is to lower manufacturing costs, so we need to explore how to best minimize the downstream impact of higher gas flow rates on capital and operating expenditure of tool-support equipment such as vacuum pumps and gas abatement systems, as well as increased subfab space requirements. This paper will consider the likely impact and trade-offs of such gas flow increases on process vacuum systems, which under a “business as usual” model would scale up purge and equipment sizes based on safety multipliers. A case study alternative considers an integrated vacuum and abatement system with a common supervisory control system and monitored joints, allowing purge nitrogen flows and equipment sizes to be reduced, and operational safety to be maintained. Both the technical and cost implications are thoroughly considered. There is an opportunity to enable 450mm capabilities by leveraging novel integration of known technologies to mitigate increased process gas flows.
Sponsorship	IEEE Electron Dev. Soc.
Starting Page	208
Ending Page	212
File Size	438732
Page Count	5
File Format	PDF
ISBN	9781479939442
DOI	10.1109/ASMC.2014.6847000
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2014-05-19
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Monitoring Safety Vacuum systems Fluid flow Temperature sensors Nitrogen sustainability 450mm G450C semiconductor cost reduction process gas flammable safety integrated system vacuum
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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