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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Xingguo Xiong Deren Lu Weiyuan Wang |
| Copyright Year | 2005 |
| Description | Author affiliation: Dept. of Electr. & Comput. Eng., Cincinnati Univ., OH (Xingguo Xiong) |
| Abstract | In this paper, a silicon-on-glass bulk-micromachined comb accelerometer with floating interconnect is introduced. The device uses unique floating back interconnect for the connection of the fixed comb fingers, which leads to more compact design. Based upon the analysis of the device behavior, an optimized device design is proposed. Simulation results show that the device has a static capacitance of 2.8pF and sensitivity of 17.9nm/g. The fabrication sequence of the accelerometer is discussed. The floating interconnection technique may be applied to other bulk-micromachined MEMS devices for 3D interconnection |
| Starting Page | 147 |
| Ending Page | 150 |
| File Size | 1658663 |
| Page Count | 4 |
| File Format | |
| ISBN | 0780391977 |
| DOI | 10.1109/MWSCAS.2005.1594060 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2005-08-07 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Accelerometers Fingers Integrated circuit interconnections Parasitic capacitance Micromechanical devices Residual stresses Electrostatics Glass Transducers Information technology |
| Content Type | Text |
| Resource Type | Article |
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