NDLI: Optimization of YBa/sub 2/Cu/sub 3/O/sub 7-x/ thick films on yttria stabilized zirconia substrates

Content Provider	IEEE Xplore Digital Library
Author	Hooker, M.W. Wise, S.A. Hopson Jr., P. Kruse, M.N.H. High, J.W.
Copyright Year	2002
Abstract	This report describes the optimization of the firing process used in the production of YBa/sub 2/Cu/sub 3/O/sub 7-x/ thick films screen printed on yttria-stabilized zirconia substrates. The highest critical current density (J/sub c/) values were obtained by employing a double layer printing technique in which a single superconductive layer was printed onto a zirconia substrate and fired, followed by the subsequent deposition and firing of second superconductive layer. Using this procedure, thick film superconductors with a superconductive transition temperature (T/sub c/) of 85 K and a J/sub c/ of 130 A/cm/sup 2/ were obtained by sintering the printed films at 950/spl deg/C for 90 minutes, followed by a six hour oxygen annealing treatment at 600/spl deg/C. Specimens sintered for comparable periods of time at 940 and 960/spl deg/C did not exhibit superconductive behavior above 77 K due to either incomplete microstructural development or thermal decomposition of the superconductive phase respectively.<>
Sponsorship	Council on Superconductivity Appl. Superconductivity Conference Inc MIT
Starting Page	1936
Ending Page	1938
Page Count	3
File Size	380162
File Format	PDF
ISSN	10518223
Volume Number	5
Issue Number	2
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1995-06-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Superconductivity Thick films Substrates Production Critical current density Printing Firing Superconducting transition temperature Superconducting films Annealing
Content Type	Text
Resource Type	Article
Subject	Condensed Matter Physics Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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