NDLI: Design, Fabrication, and Characterization of Novel Vertical Coaxial Transitions for Flip-Chip Interconnects

Content Provider	IEEE Xplore Digital Library
Author	Wei-Cheng Wu Chang, E.Y. Ruey-Bing Hwang Li-Han Hsu Chen-Hua Huang Karnfelt, C. Zirath, H.
Copyright Year	1999
Abstract	In this paper, a novel transition design using vertical ldquocoaxial transitionrdquo for coplanar waveguide (CPW-to-CPW) flip-chip interconnect is proposed and presented for the first time. The signal continuity is greatly improved since the coaxial-type transition provides more return current paths compared to the conventional transition in the flip-chip structure. The proposed coaxial transition structure shows a real coaxial property from the 3-D electromagnetic wave simulation results. The design rules for the coaxial transition are presented in detail with the key parameters of the coaxial transition structure discussed. For demonstration, the back-to-back flip-chip interconnect structures with the vertical coaxial transitions have been successfully fabricated and characterized. The demonstrated interconnect structure using the coaxial transition exhibits the return loss below 25 dB and the insertion loss within 0.4 dB from dc to 40 GHz. Furthermore, the measurement and simulation results show good agreement. The novel coaxial transition demonstrates excellent interconnect performance for flip-chip interconnects and shows great potential for flip-chip packaging applications at millimeter waves.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society IEEE Components, Packaging and Manufacturing Technology Society
Starting Page	362
Ending Page	371
Page Count	10
File Size	3413015
File Format	PDF
ISSN	15213323
Volume Number	32
Issue Number	2
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-05-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Fabrication Coaxial components Integrated circuit interconnections Frequency Coplanar waveguides Waveguide transitions Materials science and technology Electromagnetic waveguides Integrated circuit packaging MMICs transition Coaxial coplanar waveguide (CPW) flip-chip interconnect
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering

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