NDLI: Contact Resistance Properties of Cold-Pressing Superconducting Joints

Content Provider	IEEE Xplore Digital Library
Author	Junsheng Cheng Lankai Li Feng Zhou Jianhua Liu Chunyan Cui Xinning Hu Yinming Dai Luguang Yan Shunzhong Cheng Yi Li
Copyright Year	2002
Abstract	A NbTi superconducting joint technology applied for MRI/NMR has been developed with a cold-pressing method. The plastic deformation microstructure of the fabricated joint was investigated by using scanning electron microscopy and optical microscope. The joint resistances were tested using coil current decay method. The contact resistance properties of the superconducting joint were investigated. The evolution of plastic deforming and the electrical contact characteristics of the NbTi superconducting joint are discussed. It is believed that the contact resistance is composed of constriction resistance and film resistance. With the pressure increasing, the dominant factor is changed from the film resistance to the constriction resistance. Finally, the joint resistance is inversely proportional to the cubic root of applied pressure. The joint resistance correlates with the increase in plastic deformation with increased pressure.
Sponsorship	Council on Superconductivity Appl. Superconductivity Conference Inc MIT
Starting Page	1
Ending Page	4
Page Count	4
File Size	765186
File Format	PDF
ISSN	10518223
Volume Number	25
Issue Number	3
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2015-01-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Joints Resistance Superconducting magnets Films Magnetic resonance imaging Plastics Contact resistance plastic deformation superconducting joint contact resistance cold-pressing Cold-pressing
Content Type	Text
Resource Type	Article
Subject	Condensed Matter Physics Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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