NDLI: A Novel Approach to Optimizing Solder Reflow Process in Assembling PQFN Packages

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Yu, Youmin Su, Y. Q. Yao, S. A. Jiang, Y. W. Wang, Sonder
Copyright Year	2009
Abstract	Solder void is a common defect during assembling Power Quad Flat No-lead (PQFN) packages. It is detrimental to the packages’ feature of good power management and reliability performance and needs to be controlled within certain specification. Reflow process is well considered as critical to the solder void formation for a given solder paste. The transport index of reflow oven, which determines how solder paste are reflowed through solder reflowing process within the reflow oven, has therefore been optimized by a novel approach in this study. The underlying principle of the optimization is to find such a transport index that solder paste have a best possibility to experience homogeneous heat transfer during reflow phase of the whole reflow process. Different from the traditionally experimental trial and error, the present approach first predicts the optimal transport index by calculating the relative locations of lead frame (solder paste are dispensed on it) to the heating blocks of the reflow oven and the amount of heat input at different locations on the lead frame during the reflow phase. Then only necessary experiments are conducted to validate the prediction. As the theoretic calculations already screen out part of experiments that have to be conducted in the traditional trial and error, the present approach saves time and cost in practice.
Sponsorship	Electronic and Photonic Packaging Division
Starting Page	329
Ending Page	334
Page Count	6
File Format	PDF
ISBN	9780791843598
DOI	10.1115/InterPACK2009-89408
e-ISBN	9780791838518
Volume Number	ASME 2009 InterPACK Conference, Volume 1
Conference Proceedings	ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
Language	English
Publisher Date	2009-07-19
Publisher Place	San Francisco, California, USA
Access Restriction	Subscribed
Subject Keyword	Errors Heat Solders Ovens Heating Reliability Heat transfer Optimization Reflow soldering
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Modelling Heat Transfer Efficiency in Forced Convection Reflow Ovens

Nitrogen influence on the reflow soldering process optimization

Components' emissivity in reflow soldering process

Evaluation of Reflow Ovens for Lead-Free Soldering

Thermal limits in reflow soldering process

Sequential Reflow-Process Optimization to Reduce Die-Attach Solder Voids

A Numerical Study of Solder Paste Rolling Process for PCB Printing

CFD Modeling the Cooling Stage of Reflow Soldering Process

Soldering Technology for 3D PCB Assemblies with Microwave Heating

A Novel Approach to Optimizing Solder Reflow Process in Assembling PQFN Packages

Similar Documents

Modelling Heat Transfer Efficiency in Forced Convection Reflow Ovens

Nitrogen influence on the reflow soldering process optimization

Components' emissivity in reflow soldering process

Evaluation of Reflow Ovens for Lead-Free Soldering

Thermal limits in reflow soldering process

Sequential Reflow-Process Optimization to Reduce Die-Attach Solder Voids

A Numerical Study of Solder Paste Rolling Process for PCB Printing

CFD Modeling the Cooling Stage of Reflow Soldering Process

Soldering Technology for 3D PCB Assemblies with Microwave Heating

A Novel Approach to Optimizing Solder Reflow Process in Assembling PQFN Packages