NDLI: Estimation of Thermal Parameters of the Compact Electronic Enclosure Using Dynamic Thermal Response

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Kim, Jung-Kyun Nakayama, Wataru Lee, Sun-Kyu
Copyright Year	2009
Abstract	A methodology for modeling and simulating the electrothermal behavior of an enclosed electronic package is presented and validated. The electro-thermal model is constructed using system dynamics. The system model, in which the electrical and the thermal domain are combined, is presented. The developed model describes the dynamic thermal behavior system that was an electronic device in the test enclosure. An effective way to identify the thermal parameters of the system, especially the thermal contact resistance, is suggested. Based on the proposed model, either the variation of the heat source or the ambient temperature can be estimated. Simulated results were in good agreement with the measured temperature in the transient state accompanying with the variation of the environment.
Sponsorship	Electronic and Photonic Packaging Division
Starting Page	103
Ending Page	111
Page Count	9
File Format	PDF
ISBN	9780791843598
DOI	10.1115/InterPACK2009-89033
e-ISBN	9780791838518
Volume Number	ASME 2009 InterPACK Conference, Volume 1
Conference Proceedings	ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
Language	English
Publisher Date	2009-07-19
Publisher Place	San Francisco, California, USA
Access Restriction	Subscribed
Subject Keyword	Heat Temperature System dynamics Contact resistance Electronic packages Modeling Transients (dynamics)
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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