NDLI: Characterization of Viscoelasticity of Molding Compounds in Time Domain

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Chae, Seung-Hyun Zhao, Jie-Hua Darvin, R. Edwards Paul, S. Ho
Copyright Year	2009
Abstract	Although polymer-based materials are widely used in microelectronics packaging and viscoelasticity is an intrinsic characteristic of polymers, viscoelastic properties of polymeric materials are often ignored in package stress analyses due to the difficulty of measuring this property. However, it is necessary to consider the viscoelastic behavior when an accurate stress model is required. Viscoelastic properties of materials can be characterized either in the time domain or frequency domain. In this study, stress relaxation experiments were performed on a molding compound in the time domain. Prony series expansion was used to express the material’s relaxation behavior. Thermo-rheologically simple model was assumed to deduce the master curve of relaxation modulus using the time-temperature equivalence assumption. Two methods were compared to determine the Prony pairs and shift factor.
Sponsorship	Electronic and Photonic Packaging Division
Starting Page	435
Ending Page	441
Page Count	7
File Format	PDF
ISBN	9780791843598
DOI	10.1115/InterPACK2009-89388
e-ISBN	9780791838518
Volume Number	ASME 2009 InterPACK Conference, Volume 1
Conference Proceedings	ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
Language	English
Publisher Date	2009-07-19
Publisher Place	San Francisco, California, USA
Access Restriction	Subscribed
Subject Keyword	Viscoelasticity Relaxation (physics) Molding Temperature Stress analysis (engineering) Polymers Stress Microelectronic packaging
Content Type	Text
Resource Type	Article

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