NDLI: Effect of Dicing Technique on the Fracture Strength of Si Dies With Emphasis on Multi-Modal Failure Distribution

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Chae, Seung-Hyun Zhao, Jie-Hua Darvin, R. Edwards Paul, S. Ho
Copyright Year	2009
Abstract	The ball-on-ring (BOR) and 3-point bending (3PB) tests were used in this study to characterize the effect of dicing process on the fracture strength of Si dies. Dies prepared by a blade dicing process and a laser dicing process were studied. The edge-initiated fracture was distinguished from the surface-initiated fracture by the fractographic analysis. The fracture strength distributions related to surface flaws in the 3PB test as well as the BOR test were consistent regardless of dicing process. For the edge defect-induced failure mode, on the other hand, blade-sawn dies showed wider spread distribution than laser-sawn dies. It was due to the scattered nature in size and location of edge flaws induced by blade dicing. The laser-sawn dies showed a tighter distribution of the die strength although the average die strength was slightly lower than that of the blade-sawn dies. This work successfully demonstrated that the die failure caused by the edge defects can be deconvoluted from the 3PB test data by using the fractographic observation.
Sponsorship	Electronic and Photonic Packaging Division
Starting Page	401
Ending Page	409
Page Count	9
File Format	PDF
ISBN	9780791843598
DOI	10.1115/InterPACK2009-89311
e-ISBN	9780791838518
Volume Number	ASME 2009 InterPACK Conference, Volume 1
Conference Proceedings	ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
Language	English
Publisher Date	2009-07-19
Publisher Place	San Francisco, California, USA
Access Restriction	Subscribed
Subject Keyword	Fracture (process) Blades Lasers Fracture (materials) Fractography Failure Fracture toughness Failure mechanisms
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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