NDLI: Electronic Structure and Contact Resistance at the Interface Between Carbon Nanotubes and Copper Pad

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Gao, Feng Qu, Jianmin Yao, Matthew
Copyright Year	2009
Abstract	Due to their unique and superior mechanical and electrical properties, carbon nanotubes (CNTs) are a promising candidate as electrical interconnects in nanoscale electronics. A key element in using CNT as electrical interconnects is the full understanding of the mechanical and electrical behavior of the interface between the CNT and copper (Cu) pad. The objective of this paper is to study the electronic structure and the electrical contact resistance at the interface between the open end of a single wall CNT and a Cu pad. To accomplish this, simulation cell consisting of an open-end single wall CNT with each end connected to a Cu electrode was created. The Cu/CNT/Cu system is fully relaxed first before a potential bias is prescribed between the Cu electrodes. The first-principle quantum mechanical density functional and non-equilibrium Green’s function (NEGF) approaches are adopted to compute the transport coefficient, while the current-voltage (I-V) relation is then extracted by invoking the Landauer-Buttiker formalism. The average density of state (DOS) and local density of states (LDOS) are also calculated to obtain the electron energy distribution around Fermi level point. Our simulation results show that electrons are conducted through the Cu/CNT/Cu system. In the low voltage bias regime (0.0∼0.1 V), I-V relationship is found to be linear. At higher voltage (> 2.0 V), the I-V relationship is nonlinear. Our results also show that the electrical contact resistance at the CNT/Cu interface is ∼3.6 kΩ at 0.1 V, and ∼4.8 kΩ at 2.0 V. These results indicate that for open-end CNTs, the contact resistance at the CNT/Cu interface is at least comparable to that of solder/Cu interface.
Sponsorship	Electronic and Photonic Packaging Division
Starting Page	543
Ending Page	547
Page Count	5
File Format	PDF
ISBN	9780791843598
DOI	10.1115/InterPACK2009-89099
e-ISBN	9780791838518
Volume Number	ASME 2009 InterPACK Conference, Volume 1
Conference Proceedings	ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
Language	English
Publisher Date	2009-07-19
Publisher Place	San Francisco, California, USA
Access Restriction	Subscribed
Subject Keyword	Solders Electrical properties Equilibrium (physics) Carbon nanotubes Electronics Nanoscale phenomena Contact resistance Density Electrodes Simulation results Fermi level Simulation Density functional theory Electron configuration Copper Electrons
Content Type	Text
Resource Type	Article

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