NDLI: A Microelectronics-Compatible Process for Surface Micromachining of MEMS and MOEMS

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Goyal, Meetul Robert, C. Anderson Jordan, M. Berg Richard, O. Gale Holtz, Mark Temkin, Henryk
Copyright Year	2005
Abstract	Many fabrication steps for micro electromechanical and micro optoelectromechanical systems (MEMS and MOEMS) are carried out on specialized or highly customized tools that are not part of a standard microelectronics process flow. This paper presents a surface micromachining process for electrostatically-actuated MEMS devices using standard microelectronics tools, materials, and process conditions. The result should facilitate MEMS development in university laboratories with a microelectronics focus, and encourage the transfer of MEMS production to aging or underutilized industrial facilities. Aluminum structures, with silicon dioxide or silicon nitride dielectric layers, are built upon a silicon or glass wafer substrate. Shipley SC1827 photoresist provides a 2.7 μm thick sacrificial layer. The release etch is the critical fabrication step. This must be a dry process to avoid stiction, should be isotropic to minimize the etch time, and should be capable of large undercut distances to minimize the need for etch holes. Finally, the etch must be sufficiently selective to allow for the necessary release etch time without significantly impacting non-sacrificial structures. An O2/CHF3 plasma etch has been developed to meet these requirements. Using this process we have designed, fabricated and tested structures with moveable mirrors suspended over multiple drive and sense electrodes.
Sponsorship	Microelectromechanical Systems Division
Starting Page	183
Ending Page	188
Page Count	6
File Format	PDF
ISBN	079184224X
DOI	10.1115/IMECE2005-82704
e-ISBN	0791837696
Volume Number	Microelectromechanical Systems
Conference Proceedings	ASME 2005 International Mechanical Engineering Congress and Exposition
Language	English
Publisher Date	2005-11-05
Publisher Place	Orlando, Florida, USA
Access Restriction	Subscribed
Subject Keyword	Microelectromechanical systems Heart failure Silicon nitride ceramics Aluminum Stiction Micromachining Glass Microelectronic devices Etching Semiconductor wafers Critical heat flux Flow (dynamics) Plasmas (ionized gases) Electrodes Photoresists Silicon Microoptoelectromechanical systems Manufacturing Mirrors
Content Type	Text
Resource Type	Article

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