NDLI: A Novel Batch Production Technique of Metal Embedded Thin Film Microsensors for Applications in Manufacturing

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Datta, Arindom Choi, Hongseok Li, Xiaochun
Copyright Year	2005
Abstract	Effective monitoring and diagnosis of manufacturing processes is of importance in reducing operation costs, improving product quality, and reducing process time. If conditions of manufacturing tools are continuously monitored, problems can be detected and solved during the processing cycle, resulting in less tool damage, higher productivity, and less energy consumption. In-situ monitoring of the basic operating conditions (e.g. temperature and strain) of certain mechanical tools and components can be accomplished by placing microsensors in some critical locations. Thin film microsensors (e.g. thermocouple, strain gauge) have drawn considerable attention recently due to their small size, fast response and lower cost [1]. Since most tools and components in manufacturing process are metallic, metal embedded thin film microsensors are very attractive. A new batch fabrication technique based on electroplating and wet chemical etching of silicon has been developed. Microsensors were directly fabricated on an etch stop layer grown on silicon wafer. A multilayer dielectric is deposited to insulate sensor areas followed by seed layer deposition, and electroplating a thicker metal layer. After silicon wafer is etched out, the microsensors are transferred from silicon to electroplated metal substrate directly. After plasma etching of the etch stop layer, these sensors can be further embedded into another electroplated metal layer from the top after insulation by dielectric multilayer. Metal embedded strain gauge array was fabricated successfully. Thin film Ni/Cr strain gauges were fabricated on LPCVD silicon nitride layer grown on a 3-inch silicon wafer. Each strain gauge unit was insulated by Al2O3/PECVD SixNy/Al2O3 multilayer before seed layer deposition and electroplating a thick nickel layer on whole wafer. Si wafer was then etched out in KOH solution to transfer all microsensors to electroplated nickel layer. LPCVD nitride layer covering the sensors was dry etched and same multilayer dielectric was selectively deposited over the sensors except pad areas. These microsensors were finally embedded into another electroplated nickel layer leaving the pads uncovered for external connection. This process offers a novel way to realize batch production of metal embedded microsensors for use in hostile manufacturing environment.
Sponsorship	Microelectromechanical Systems Division
Starting Page	143
Ending Page	144
Page Count	2
File Format	PDF
ISBN	079184224X
DOI	10.1115/IMECE2005-81211
e-ISBN	0791837696
Volume Number	Microelectromechanical Systems
Conference Proceedings	ASME 2005 International Mechanical Engineering Congress and Exposition
Language	English
Publisher Date	2005-11-05
Publisher Place	Orlando, Florida, USA
Access Restriction	Subscribed
Subject Keyword	Product quality Cycles Energy consumption Insulation Silicon nitride ceramics Temperature Metals Thermocouples Strain gages Semiconductor wafers Etching Electroplating Chemical etching Plasma-enhanced chemical vapor deposition Thin films Plasma etching Manufacturing tools Nickel Silicon Manufacturing Sensors Damage Microsensors
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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