NDLI: Active components embedded into organic boards - Accelerated design by means of finite element simulation and micro deformation measurements

Content Provider	IEEE Xplore Digital Library
Author	Sommer, J.-P. Michel, B. Noack, E. Seiler, B.
Copyright Year	2009
Description	Author affiliation: Fraunhofer Research Institution for Electronic Nano Systems (ENAS), Micro Materials Center Berlin/Chemnitz, D-09117, Germany, Otto-Schmerbach-Str. 19 (Sommer, J.-P.; Michel, B.; Noack, E.) \|\| Chemnitzer Werkstoffmechanik GmbH, Chemnitz, D-09117, Germany, Otto-Schmerbach-Str. 19 (Seiler, B.)
Abstract	More and more dense packaging is one of the most important challenges in advanced electronics and micro technology. One way to achieve this is to bury active as well as passive components into the printed circuit boards. In addition, very short interconnects can be realised which is advantageous especially for RF applications. Besides the pure functionality, the designers of new products have to meet reliability requirements. This is not only related to the electrical properties but also to the thermal as well as the thermo-mechanical design. As most as possible of the imaginable loading conditions have to be investigated which are expected during manufacturing, testing, storing, and operation. This can be done efficiently by numerical studies based on finite element analyses (FEA), accompanied by deformation measurements at suitable test structures. The resulting methodology is outlined here, can be generalised, and applied to many design procedures before any real parts are available [1]. It is helpful to reduce cost and time-to-market for future products by minimising real tests and an expensive redesign.
Starting Page	338
Ending Page	342
File Size	4595999
Page Count	5
File Format	PDF
ISBN	9781424438747
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-04-01
Publisher Place	Italy
Access Restriction	Subscribed
Rights Holder	EDA Publishing
Subject Keyword	Deformable models Radio frequency Circuit simulation Printed circuits Integrated circuit interconnections Product design Acceleration Finite element methods Testing Electronics packaging
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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