NDLI: Heat dissipation performance for the application of light emitting diode

Content Provider	IEEE Xplore Digital Library
Author	Ming-Tzer Lin Chao-Chi Chang Ray-Hua Horng De-Shau Huang Chi-Ming Lai
Copyright Year	2009
Description	Author affiliation: Department of Mechanical Engineering, Nan-Kai University of Technology, Nantou, 542, Taiwan, R.O.C. (De-Shau Huang) \|\| Institute of Precision Engineering, National Chung Hsing University, Taichung 402, Taiwan, R.O.C. (Ming-Tzer Lin; Chao-Chi Chang; Ray-Hua Horng) \|\| Department of Civil Engineering, National Cheng Kung University, Tainan, 700 Taiwan, R.O.C (Chi-Ming Lai)
Abstract	This study was to design and develop the efficient heat dissipation methods for light emitting diode (LED). There are two major achievements in the study: (1) Chips level: Improve the LED packaging materials and layers assembly of LED. This novel design was to introduce additional thin copper layer materials on LED base assembly with geometry that can reduce thermal resistance and increase thermal diffusion efficiency. The design was then being calculated on its heat transfer behavior using simulation with 3-D finite element method. The experimental and simulation results of various packaging area parameters were presented with respect to 0.75W, 1W and 3W LED chips. Both experimental and simulation results show close agreement that through the design of additional packaging arrangement it can reduce the thermal equilibrium temperature of LED. It was found that the addition of $9cm^{2}$ copper-packaged area improves the thermal dissipation of LED, resulting in a reduction of chip temperature lower 5°C than non-packaging pattern. (2) System level: Design and develop heat pipe structures as heat sink for a LED illuminator set. The experiments were conducted to investigate the cooling characteristics of heat pipes by changing working fluid mass and working angle. Additionally, both discrete hotspot of LED and central heating of heat pipe were studied. The results of heat pipe experiments show that when the experimental set of LED illuminator was used in horizontal angles, resulting in the heat pipe which fills 2.52g water volume has the best thermal properties than others. Resulting in the heat source temperature maintain in 50°C. Whereas others have higher temperature results due to the steam inside pipe choked. The experiment and simulation results show in this study provide very useful contributions for the application of heat dissipation for LED both in chip level packages and system level performance.
Starting Page	145
Ending Page	149
File Size	2643535
Page Count	5
File Format	PDF
ISBN	9781424438747
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-04-01
Publisher Place	Italy
Access Restriction	Subscribed
Rights Holder	EDA Publishing
Subject Keyword	Geometry Temperature Thermal resistance Water heating Packaging Light emitting diodes Heat Dissipate of LED Heat Pipe for LED Copper Heat sinks Assembly Heat transfer
Content Type	Text
Resource Type	Article

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