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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Ramstad, J.E. Kjelgaard, K.G. Nordboe, B.E. Soeraasen, O. |
| Copyright Year | 2009 |
| Description | Author affiliation: Department of Informatics, University of Oslo, P.O. Box 1080 Blindern, N-0316, Norway (Ramstad, J.E.; Kjelgaard, K.G.; Nordboe, B.E.; Soeraasen, O.) |
| Abstract | The paper describes the design of multiple RF MEMS front-end components that could replace off-chip units in future transceivers. The components can effectively be combined and co-fabricated with CMOS circuitry. A CMOS-MEMS approach is used, which means that the microelectromechanical parts are made by multi-layer structures in a standard CMOS process. The ASIMPS procedure offered by CMP uses the CMOS processing at STMicroelectronics, and a simple post-CMOS release-etching step is performed at Carnegie Mellon University, USA. The paper presents a resonator, resonating filters, electrothermally operated varactors and an experimental switch. The components are modeled and simulated by using CoverntorWare FEM software. A test chip is currently in production. |
| Starting Page | 170 |
| Ending Page | 175 |
| File Size | 694447 |
| Page Count | 6 |
| File Format | |
| ISBN | 9781424438747 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2009-04-01 |
| Publisher Place | Italy |
| Access Restriction | Subscribed |
| Rights Holder | EDA Publishing |
| Subject Keyword | Varactors Semiconductor device modeling Resonator filters Circuits Switches Electrothermal effects Radiofrequency microelectromechanical systems CMOS process Transceivers Testing |
| Content Type | Text |
| Resource Type | Article |
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