NDLI: A reliability test on PBGA packaging through piezoresistive stress sensor

Content Provider	IEEE Xplore Digital Library
Author	Liu, C.H. Chung, H. Yang, D.W. Tseng, K.F. Lwo, B.J.
Copyright Year	2009
Description	Author affiliation: Semiconductor Laboratory, Chung-Cheng Institute of Technology, National Defense University, Ta-Shi, Tao-Yuan, 33509, Taiwan, R.O.C (Liu, C.H.; Chung, H.; Yang, D.W.; Lwo, B.J.) \|\| Department of Electronic Engineering, Chin-Min Institute of Technology, Tao-Fan, Miao-Li, 35153, Taiwan, R.O.C. (Tseng, K.F.)
Abstract	Plastic packaging is the mainstream on microelectronic packaging technology at present. As the continuous requirements for smaller but higher density products, failure and reliability issues on MEMS/MOEMS packaging because of the hygroscopic swelling mismatch stress become more and more serious. To this end, this paper presented the stress monitoring methodologies as well as the reliability tests on a typical PBGA (Plastic Ball-Grid-Array) packaging due to hygroscopic effects through the measurements with the piezoresistive stress sensors. It is concluded from the experiments in this work that the hygroscopic mismatch stress is significant for the packaging, and the Weibull reliability model is suitable for the PBGA packaging. In addition, piezoresistive sensors were proven useful for monitoring the stress on the chip inside the packaging structure.
Starting Page	47
Ending Page	50
File Size	258931
Page Count	4
File Format	PDF
ISBN	9781424438747
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-04-01
Publisher Place	Italy
Access Restriction	Subscribed
Rights Holder	EDA Publishing
Subject Keyword	Micromechanical devices Moisture Plastic packaging Microelectronics Piezoresistance Monitoring Semiconductor device packaging Testing Stress measurement Electronics packaging
Content Type	Text
Resource Type	Article

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