NDLI: Integrated Thermo-Electro-Mechanical Modeling of 3D e-Cubes Structures

Content Provider	IEEE Xplore Digital Library
Author	Janczyk, G. Bieniek, T. Janus, P. Kociubinski, A. Grabiec, P. Szynka, J. Reitz, M.S. Schneider, P. Kaulfersch, E. Weber, J.
Copyright Year	2007
Description	Author affiliation: Inst. of Electron Technol., Warsaw (Janczyk, G.; Bieniek, T.; Janus, P.; Kociubinski, A.; Grabiec, P.; Szynka, J.)
Abstract	The complex silicon systems formed by the several specialized devices like SOC, RF devices, power devices, MEMS wafers are fabricated in dedicated technologies. If the designer attempts to integrate them into the one big multifunctional system, he meets the new, yet unexplored fields for the multidisciplinary, mutually dependent thermal, electrical, EM and mechanical parameters modeling. This article attempts to clarify, and presents how to simplify this problem.
Starting Page	297
Ending Page	300
File Size	938804
Page Count	4
File Format	PDF
ISBN	8392263243
DOI	10.1109/MIXDES.2007.4286171
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-06-21
Publisher Place	Poland
Access Restriction	Subscribed
Rights Holder	Tech Univ of Lodz Dept of Microelectronics & Computer Science
Subject Keyword	Computational modeling Interconnects Iron High Level Device Description System Simulation Thermo-Electro-Mechanical Simulation Radio frequency Micromechanical devices Fabrication e-Cubes Verilog-AMS Hardware design languages Assembly Thermal stresses Resistance heating Electrons
Content Type	Text
Resource Type	Article

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Integrated Thermo-Electro-Mechanical Modeling of 3D e-Cubes Structures