NDLI: The effects on SI and EMI for differential coupled microstrip lines over LPC-EBG power/ground planes

Content Provider	IEEE Xplore Digital Library
Author	Cheng-Hung Shih Guang-Hwa Shiue Tzong-Lin Wu Ruey-Beei Wu
Copyright Year	2008
Description	Author affiliation: Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei (Cheng-Hung Shih; Guang-Hwa Shiue; Tzong-Lin Wu; Ruey-Beei Wu)
Abstract	A power/ground planes design for efficiently eliminating the ground bounce noise (GBN) in high-speed digital circuits is proposed by using low-period coplanar electromagnetic band-gap (LPC-EBG) structure. However, it is unavoidable the signals will cross the LPC-EBG power plane. In this paper, the effects of signal integrity (SI) and electromagnetic interference (EMI) for differential coupled microstrip lines over the LPC-EBG power/ground planes will be investigated. The resonant frequency of LPC-EBG power plane will be picked up and appear in the radiation. The bandgap frequencies of LPC-EBG power plane will loss in weakly coupling case of differential lines at the received end. Further, the more coupling factor of differential lines is the less noise of SI and EMI is. The simulated results based on full-wave simulator will provide a good reference for the design of differential coupled microstrip lines over LPC-EBG power/ground planes.
Starting Page	164
Ending Page	167
File Size	315744
Page Count	4
File Format	PDF
ISBN	9789810806293
DOI	10.1109/APEMC.2008.4559837
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-05-19
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Asia Pacific EMC Society
Subject Keyword	ground bounce noise(GBN) electromagnetic bandgap (EBG) Gsimultaneous switching noise (SSN) Electromagnetic interference electromagnetic interference (EMI) slot Microstrip signal integrity (SI)
Content Type	Text
Resource Type	Article

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