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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Hui-Chuan Lu Wei-Liang Chan Hsui-Li Lee Yu-Jen Fang Chieh-Ling Hsiao Chih-Hung Wang Chang, P. Chin-Ching Huang Ming-Te Tu |
| Copyright Year | 2007 |
| Description | Author affiliation: Ind. Technol. Res. Inst. South, Tainan (Hui-Chuan Lu; Wei-Liang Chan; Hsui-Li Lee; Yu-Jen Fang; Chieh-Ling Hsiao; Chih-Hung Wang; Chang, P.) |
| Abstract | This paper investigates about characteristic measurement methods and experimental results for micro-capacitance and electro-acoustics of wafer level MEMS microphone. And this paper also studies packaging and measurement for the microphone product to verify yield of semi-finished products from the measurement methods to save cost of the production. The repeatability of the micro-capacitance measurement system is high, and construction of direct sound source with high stability and uniformity can make high repeatability and can help understand more about impact of reflection of acoustic field for measuring the sound intensity. |
| Starting Page | 18 |
| Ending Page | 21 |
| File Size | 632455 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781424416363 |
| DOI | 10.1109/IMPACT.2007.4433559 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2007-10-01 |
| Publisher Place | Taiwan |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Micromechanical devices Capacitance-voltage characteristics Voltage Packaging Sensor phenomena and characterization Acoustic measurements Pressure measurement Capacitance measurement Wafer scale integration Microphones |
| Content Type | Text |
| Resource Type | Article |
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