NDLI: Finite element analysis of phased plano-concave multi-layer transducers

Content Provider	IEEE Xplore Digital Library
Author	Hossack, J.A. Shiwei Zhou Powell, D.J.
Copyright Year	2001
Description	Author affiliation: Biomed. Eng. Dept., Virginia Univ., Charlottesville, VA, USA (Hossack, J.A.)
Abstract	Phased multi-layer transducers offer the potential for yielding very high (multiple octave) usable bandwidth. The null normally encountered at the second harmonic is avoided and replaced with a resonant peak. However, the resulting spectrum exhibits a number of 'bumps' that result in an undesirable 'tail' in the time-domain impulse response. In this paper we present new results obtained using finite element analysis of modified multi-layer transducers in which the elements have diverse thickness so as to smooth out the associated spectral response. In this example we use dual-layer plano-concave elements. 3D finite element analysis is well suited to these complex 3D devices since they can include finite dimension effects in all three directions and properly account for the irregular geometry. Fortunately both the PZFlex finite element analysis technique and the materials of interest (PZT-5H type material) are very well characterized at this time and thereby enable reliable, accurate virtual design and test. In this paper we explore some of the design variables (e.g. maximum ratio of the thickness dimensions along the PZT bar element) and determine the practical extent of achievable bandwidth consistent with a smooth spectral characteristic, relatively uniform thickness vibrational motion and a lack of spurious lateral wave activity.
Sponsorship	Ultrasonics, Ferroelectr., & Frequency Control Soc
Starting Page	1003
Ending Page	1006
File Size	273988
Page Count	4
File Format	PDF
ISBN	0780371771
DOI	10.1109/ULTSYM.2001.991889
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2001-10-07
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Finite element methods Bandwidth Geometry Ceramics Biomedical transducers Materials reliability Material properties Dielectric materials Impedance Biomedical engineering
Content Type	Text
Resource Type	Article

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