NDLI: Measurements of interfacial strengths in underfilled flip-chip electronic packages using Wedge Delamination Method (WDM)

Content Provider	IEEE Xplore Digital Library
Author	Sinha, T. Sikka, K.K. Yannitty, D.N. Bodenweber, P.F.
Copyright Year	2014
Description	Author affiliation: IBM Microelectron., Hopewell Junction, NY, USA (Sinha, T.; Sikka, K.K.; Yannitty, D.N.; Bodenweber, P.F.)
Abstract	In this work, a new wedge delamination technique for measurement of interfacial fracture strength is presented. This method can be implemented to assess the interfacial fracture behavior of underfill and silicon in flip-chip packages. Our method offers substantial advantages over traditional interfacial test methods which can be difficult to implement on brittle materials like silicon die. The efficacy of our method for interfacial strength measurements on multiple underfill-silicon interfaces will be shown in this work. A numerical framework for crack kinking at the silicon-underfill interface will also be presented. And finally, results from WDM experiments conducted at room temperature and corresponding numerical analysis will be used to compare the relative fracture strength between underfill and silicon at the flat-face and sidewall of a silicon die.
Starting Page	346
Ending Page	354
File Size	2476374
Page Count	9
File Format	PDF
ISBN	9781479952670
ISSN	10879870
DOI	10.1109/ITHERM.2014.6892301
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2014-05-27
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Silicon Delamination Abstracts Wavelength division multiplexing Stress Equations silicon die Underfill Encapsulant Chip-package interaction (CPI) interfacial failure fracture toughness delamination
Content Type	Text
Resource Type	Article

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Measurements of interfacial strengths in underfilled flip-chip electronic packages using Wedge Delamination Method (WDM)

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