NDLI: Defining thermal design power based on real-world usage models

Content Provider	IEEE Xplore Digital Library
Author	Ganapathy, D. Warner, E.J.
Copyright Year	2008
Description	Author affiliation: Intel Corp., Folsom, CA (Ganapathy, D.; Warner, E.J.)
Abstract	The power dissipated by electronic components has been steadily increasing, but financial and form factor restrictions exist on the cooling solution and the pressure is on to improve the power dissipation capability. The main parameter used for designing a component's cooling system is known as Thermal Design Power (TDP). This parameter is used as a steady state power target that the cooling solution must be able to cool. This is not the maximum instantaneous power that can be dissipated by the component, but is the 'average' power that needs to be cooled while running a typical real-world stress application. The difference arises because of the transient nature of real-world applications and the thermal capacitance of the system. The current paper describes a physics based approach to average the instantaneous power dissipated by real-world applications into a meaningful thermal equivalent. An empirical thermal transient model of the component package and cooling solution was built to convert power traces into temperature responses. The predicted temperature responses were then analyzed to come up with a derating factor of up to 25% applied to the maximum instantaneous power. This methodology allows the component TDP to be defined based on real-world usage scenarios, leading to more realistic thermal design targets helping to reduce cost and prevent over-design.
Starting Page	1242
Ending Page	1246
File Size	284475
Page Count	5
File Format	PDF
ISBN	9781424417001
ISSN	10879870
DOI	10.1109/ITHERM.2008.4544402
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-05-28
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electronic packaging thermal management Power system modeling Electronics cooling Temperature Electronic components Power dissipation Steady-state Thermal stresses Capacitance Physics real-world application power transient response power fluctuations thermal capacitance thermal design power (TDP) power dissipation capability (PDC)
Content Type	Text
Resource Type	Article

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