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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Goel, N. Anoop, T.K. Bhattacharya, A. Cervantes, J.A. Mongia, R.K. Machiroutu, S.V. Hau-Lan Lin Ya-Chi Huang Kuang-Cheng Fan Bar-Long Denq Chen-Hua Liu Chun-Hung Lin Chi-Wei Tien Pan, J.-H. |
| Copyright Year | 2008 |
| Description | Author affiliation: Intel Technol. India Pvt. Ltd., Bengaluru (Goel, N.; Anoop, T.K.; Bhattacharya, A.) |
| Abstract | There is a need for standard TIM characterization technique for notebook specific applications. The current standard method, ASTM D5470 tester neglects the usage conditions encountered in mobile specific applications. In addition, characterizing "Beginning of Life" performance of TIMs is not sufficient as performance can degrade with usage. This paper emphasizes the importance of considering TIM degradation in mobile applications. Various TIM characterization approaches prevalent in industry are discussed in this paper. There is also wide disparity in testing methodologies used across industry to evaluate its performance maps with usage. A set of characterization techniques for better TIM evaluation practices are suggested. |
| Starting Page | 248 |
| Ending Page | 258 |
| File Size | 240227 |
| Page Count | 11 |
| File Format | |
| ISBN | 9781424417001 |
| ISSN | 10879870 |
| DOI | 10.1109/ITHERM.2008.4544277 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2008-05-28 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Thermal conductivity Thermal resistance Surface resistance Testing Conducting materials Contact resistance Rough surfaces Surface roughness Thermal management Thermal degradation characterization methods Thermal interface material TIM ASTM D5470 reliability |
| Content Type | Text |
| Resource Type | Article |
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