NDLI: Mechanistic figures of merit for die-attach materials

Content Provider	IEEE Xplore Digital Library
Author	Gektin, V. Bar-Cohen, A.
Copyright Year	1996
Description	Author affiliation: Dept. of Mech. Eng., Minnesota Univ., Minneapolis, MN, USA (Gektin, V.; Bar-Cohen, A.)
Abstract	Delamination and/or rupture of the die-attach layer are among the primary failure mechanisms in plastic IC packages and often lower the threshold for other mechanical, as well as electrical, failure mechanisms. Die-attach failure is generally caused by the thermal expansion (contraction) mismatch of dissimilar materials and the consequent development of axial and shear stresses in the adhesive and along the material interfaces. To enhance the reliability of plastic packaging it is thus desirable to select the most reliable and cost-effective die-attach material. Analysis of an ideal tri-material structure, using a force and momentum balance, makes it possible to derive analytical relations for the axial and shear stresses in a die-attach layer. Based on these analytical relations, which are validated against FEM results, the critical material properties can be selected and used for the development of Figures-of-Merit (FOM) for material selection. These FOMs are then used to evaluate the effects of moisture on the selection of the die-attach materials.
Starting Page	306
Ending Page	313
File Size	687355
Page Count	8
File Format	PDF
ISBN	078033325X
DOI	10.1109/ITHERM.1996.534577
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1996-05-29
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Magneto electrical resistivity imaging technique Thermal stresses Plastic packaging Failure analysis Thermal expansion Delamination Temperature Equations Plastic integrated circuit packaging Materials reliability
Content Type	Text
Resource Type	Article

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