NDLI: Integrated thermal analysis of indirect air-cooled electronic chassis

Content Provider	IEEE Xplore Digital Library
Author	Tang, L. Joshi, Y.
Copyright Year	1996
Description	Author affiliation: CALCE Electron. Packaging Res. Center, Maryland Univ., College Park, MD, USA (Tang, L.; Joshi, Y.)
Abstract	Steady conjugate heat transfer in an air filled electronic chassis, which is indirectly cooled by forced air along its top and bottom walls, is investigated numerically. Four PCBs (printed circuit boards) vertically located in the chassis form five separate air compartments for natural convection to take place. Along the top and bottom walls of the chassis, cooling air, flowing inside finned channel passages, removes the heat generated by the PCBs. The effects of temperature distributions on the top and bottom walls of the chassis on the PCB temperature field are of prime interest here. The integrated system and board level modeling is done using a two step process. First, a simplified computational model is developed for the finned channel, which calculates the nonuniform temperature distributions on the top and bottom walls of the chassis. By applying the calculated top and bottom wall temperature distributions as boundary conditions, a three dimensional numerical study is next performed using control volume based finite volume scheme to calculate the detailed temperature fields. This model considers the conduction within the PCBs, as well as the natural convection within the adjacent air. To elucidate the importance of an integrated system and board level analysis, the results are compared with those for conventional constant wall temperature boundary conditions on the chassis top and bottom walls.
Starting Page	217
Ending Page	225
File Size	698306
Page Count	9
File Format	PDF
ISBN	078033325X
DOI	10.1109/ITHERM.1996.534565
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1996-05-29
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Temperature Electronic packaging thermal management Thermal conductivity Heat transfer Thermal expansion Electronics cooling Kinematics Viscosity Solids Logic
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Integrated thermal analysis of indirect air-cooled electronic chassis

Study on Chimney effect on natural air cooling of electronic equipment under inclination

Forced convection air-cooling of a commercial electronic chassis: an experimental and computational case study

Numerical Investigation Based on CFD for Air Impingement Heat Transfer in Electronics Cooling

Thermal wake models for forced air cooling of electronic components

Heat transfer in cooling systems of microelectronic equipment with partially submerged condensers

Natural convection air cooling of a discrete source on a conducting board in a shallow horizontal enclosure

Convective heat transfer in graphite foams with complex structures

A boundary element formulation of the conjugate heat transfer from a convectively cooled discrete heat source mounted on a substrate

Integrated thermal analysis of indirect air-cooled electronic chassis

Similar Documents

Integrated thermal analysis of indirect air-cooled electronic chassis

Study on Chimney effect on natural air cooling of electronic equipment under inclination

Forced convection air-cooling of a commercial electronic chassis: an experimental and computational case study

Numerical Investigation Based on CFD for Air Impingement Heat Transfer in Electronics Cooling

Thermal wake models for forced air cooling of electronic components

Heat transfer in cooling systems of microelectronic equipment with partially submerged condensers

Natural convection air cooling of a discrete source on a conducting board in a shallow horizontal enclosure

Convective heat transfer in graphite foams with complex structures

A boundary element formulation of the conjugate heat transfer from a convectively cooled discrete heat source mounted on a substrate

Integrated thermal analysis of indirect air-cooled electronic chassis