NDLI: Moisture diffusion and heat transfer in plastic IC packages

Content Provider	IEEE Xplore Digital Library
Author	Tay, A.A.O. Lin, T.Y.
Copyright Year	1996
Description	Author affiliation: Center for Integrated Circuit Failure Anal. & Reliability, Nat. Univ. of Singapore, Singapore (Tay, A.A.O.; Lin, T.Y.)
Abstract	This paper deals with two-dimensional finite element simulations of moisture diffusion during preconditioning of plastic IC packages, as well as the simultaneous diffusion of heat and moisture during vapor phase reflow soldering. The results show good agreement with experimental data. The limitations of hitherto one-dimensional analyses are also examined. The transient build-up of water vapor pressure in the delaminated pad-resin interface during vapor phase reflow soldering is obtained. It is found that, irrespective of the manner of moisture preconditioning (moisture absorption or desorption), the same critical water vapor pressure level of about 0.9 MPa is obtained for the plastic IC package under study. It is also shown that the water vapor in the delaminated interface never reached saturation during the short period when solder is reflowed and re-solidified. These findings have important implications for the analysis of "popcorn" cracking during solder reflow. They show that any package stress analysis which assumes that the vapor pressure at the delaminated pad-resin interface is equal to the saturation vapor pressure is likely to be erroneous.
Starting Page	67
Ending Page	73
File Size	554700
Page Count	7
File Format	PDF
ISBN	078033325X
DOI	10.1109/ITHERM.1996.534546
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1996-05-29
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Moisture Heat transfer Plastic integrated circuit packaging Absorption Resins Reflow soldering Integrated circuit packaging Finite element methods Temperature Plastic packaging
Content Type	Text
Resource Type	Article

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