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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Shomo Chen Ning Huang Ting-Pu Tai Niu, A. |
| Copyright Year | 2009 |
| Abstract | Chip quality is becoming more difficult to maintain as the process geometry shrinks. Not only is design complexity higher, but new defect types cause DPM (defects per million) to increase. At the same time, the amount of embedded memory in many applications continues to grow, making memory testing a key factor in maintaining low cost and high quality in IC manufacturing. While commercial EDA tools are keeping pace with the need for greater test flow automation, new test algorithms are also needed to minimize the rate of field returns at advanced technology nodes. This paper describes how ASIC vendors can develop customized memory test algorithms to enhance their overall IC testing strategy. |
| Starting Page | 87 |
| Ending Page | 89 |
| File Size | 332389 |
| Page Count | 3 |
| File Format | |
| ISBN | 9780769538648 |
| ISSN | 10817735 |
| DOI | 10.1109/ATS.2009.41 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2009-11-23 |
| Publisher Place | Taiwan |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Circuit faults Decoding Fault detection Circuit testing Geometry Integrated circuit testing Built-in self-test Application specific integrated circuits Automatic testing Combinational circuits |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electrical and Electronic Engineering |
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