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International Test Conference 1988 Proceeding@m_New Frontiers in Testing

Stress profile derivation-an empirical approach

Content Provider	IEEE Xplore Digital Library
Author	Walker, A.C.
Copyright Year	1990
Description	Author affiliation: IBM Corp., San Jose, CA, USA (Walker, A.C.)
Abstract	The author describes how a thermal stress test profile was derived by experiment for more effective screening of IBM Personal System 2 planar cards. Profile components are optimized from Model 50 experimental data and reassembled into an empirically engineered power-temperature profile used in stress testing electronic cards. The resultant profile is shown to be more effective in accelerating early life failures and has become the standard framework for all PS/2 stress profiles used in IBM Greenock's SMT (surface mount technology) card stress screening. Thermal shock and voltage biasing have been introduced into Greenock's stress test for the first time.
Starting Page	193
Ending Page	207
File Size	671432
Page Count	15
File Format	PDF
ISBN	081869064X
DOI	10.1109/TEST.1990.114018
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1990-09-10
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thermal stresses Surface-mount technology System testing Power system modeling Data engineering Power engineering and energy Electronic equipment testing Acceleration Electric shock Voltage
Content Type	Text
Resource Type	Article

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