NDLI: Establishment of the mesoscale parameters for epoxy-copper interfacial separation

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Establishment of the mesoscale parameters for epoxy-copper interfacial separation

Content Provider	IEEE Xplore Digital Library
Author	Wong, C.K.Y. Leung, S.Y.Y. Poelma, R.H. Jansen, K.M.B. Yuan, C.C.A. van Driel, W.D. Zhang, G.Q.
Copyright Year	2012
Description	Author affiliation: Philips Lighting, Mathidelaan 1, 5611 BD Eindhoven, The Netherlands (van Driel, W.D.) \|\| Faculty EWI, Department of Microelectronics, Delft University of Technology, Feldmannweg 17, 2628CT, The Netherlands (Poelma, R.H.; Zhang, G.Q.) \|\| Faculty 3mE, Department PME, Delft University of Technology, Mekelweg 2, 2628 CD, The Netherlands (Wong, C.K.Y.; Leung, S.Y.Y.; Jansen, K.M.B.) \|\| TNO, De Rondom 1, 5612 AP Eindhoven, The Netherlands (Yuan, C.C.A.)
Abstract	Mesoscale parameters, which describe the atomic interactions of the polymer-metal interface at the separation process, are important in the development of a coarse grain model for the interfacial adhesion study. A non-equilibrium molecular dynamics model is established to obtain the traction-displacement relations of the separation of epoxy-copper interfaces. We study three influencing parameters of the relations including dynamics time, displacement increment and model sizes. It illustrates that the displacement rate as related to the dynamics time has to be above a critical value to ensure the separation. The model has been benchmarked by comparing the deduced interaction energy with the thermodynamics work of adhesion reported in literature. An analytical scheme to discern the mesoscale parameters (the interaction energy and the equilibrium distance) from the relations is discussed. The proposed methodology contributes to the multiscale model development of interfacial separation.
File Size	1131426
File Format	PDF
ISBN	9781467315128
e-ISBN	9781467315135
DOI	10.1109/ESimE.2012.6191737
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-04-16
Publisher Place	Portugal
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Gold Reliability Argon Heating Annealing
Content Type	Text
Resource Type	Article

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