NDLI: Evaluation of quasi-hermetic packaging solutions for active microwave devices and space applications

Please wait, while we are loading the content...

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

Advanced mixed-mode bending test: A rapid, inexpensive and accurate method for fracture-mechanical interface characterisation

An approach to life consumption monitoring of solder joints in operating temperature environment

Thermal management for stackable packages with stacked ICs

Influence of the barrier properties on the mechanical stress and migration distribution in a copper metallization

Molecularly derived mesoscale modeling of an epoxy/Cu interface (part III*): Interface roughness

Comparison of Ni- and SiGe-based MEMS magnetometers

PZT piezoelectric coefficient extraction by PZT-actuated micro-beam characterization and modeling

Evaluation of quasi-hermetic packaging solutions for active microwave devices and space applications

Anisotropic strain-field-induced change of the electronic conductivity of graphene sheets and carbon nanotubes

Residual stresses in isotropic conductive adhesives with nano-Ag particles

GaN growth on patterned silicon substrates. A thermo mechanical study on wafer bow reduction

Investigation of chip temperature related to various copper thickness on glass-fabric-based substrate

Material characterization to model linear viscoelastic behavior of thin organic polymer films in microelectronics

Investigation on the effect of surface roughness on the fracture strength of SCS

Transient electro-thermal simulation of interconnected systems

Effect of isothermal aging and salt spray tests on reliability and mechanical strength of eutectic Sn-Bi lead-free solder joints

An extensive investigation of the four point bending test for interface characterization

Shear stress modeling of ACA joints in thermal tests

Evaluation of very low bending radius of flexible circuits beyond the standard design rules

3-D finite elements simulation of drop test reliability on a Chip Scale Package: Focus on the component architecture and materials

Transport of moisture at epoxy-SiO interfaces investigated by molecular modeling

Numerical modelling of anchor losses in MEMS resonators

Thermal modeling of active embedded chip into high density electronic board

A simplified and meaningful crack propagation model in silicon for microelectronic power devices

A comparison of the creep behaviour of joint-scale SAC105 and SAC305 solder samples under shear conditions

Study of CNT growth termination mechanism: Effect of catalyst diffusion

In situ vibration measurements on power modules under operating conditions

Transient thermal analysis as failure analytical tool in electronic packaging

Testing and multi-scale modeling of drop and impact loading of complex MEMS microphone assemblies

In-situ - characterization of moisture induced swelling behaviour of microelectronic relevant polymers

Simulation of the frequency response of a thermal flow sensor in gaseous media

A novel wafer -level test method to measure the bond strength in microelectronic materials

Simulations of a high temperature pressure sensor packaging and interconnection

Thermal performance evaluation of SiC power devices packaging

Accelerated lifetime measurements of Cu-Al ball bonded interconnects

Thermal improvement of die attach with iodine treatment and its application in solid state lighting

3D electrostatic microgenerator

Combined creep and fatigue measurement method for lead-free solder alloys

Cu/epoxy interface enhancement and characterization with thiol treatment

Establishment of the mesoscale parameters for epoxy-copper interfacial separation

Wettability of organic ferroelectric material on metal substrate

Establishing the interfacial fracture properties of Cu-EMC interfaces at harsh condition

Characterization of intermetallic compounds in Cu-Al ball bonds: Mechanical properties, delamination strength and thermal conductivity

Molecular modeling of the conductivity changes of the emeraldine base polyaniline due to protonic acid doping

Thermo-mechanical investigation of the reliability of embedded components in PCBs during processing and under bending loading

Experimental system for analysing the combined loading and failure modes of solder joints in electronic packaging

Parameter optimization of torque wireless sensors based on surface acoustic waves (SAW)

Thermo-mechanical characterization and modeling of TSV annealing behavior

Stress chip measurements of the internal package stress for process characterization and health monitoring

Viscoplastic behavior of diamond die attach subjected to high temperature conditions

Increasing the robustness for reliable packages by prediction of delamination by cohesive zone element simulation

MEMS accelerometers and their bio-applications

Thermal resistance investigations on new leadframe-based LED packages and boards

LED driver thermal design considerations for solid-state lighting technologies

Simulations of thermo-elastic losses in a meta-material bulk bar resonator

Optimized design and placement of piezoelectric transducers for micromechanical structures subject to membrane stress

Thermo-mechanical reliability of embedded capacitors

Modeling lead free solder reliability in SSL applications towards virtual design

Lifetime assessment of BGA solder joints with voids under thermo-mechanical load

2D finite elements electro-thermal modeling for IGBT: Uni and multicellular approach

Modelling of the Electric Field Assisted Capillarity Effect used for the fabrication of hollow polymer microstructures

Influence of conversion level on simulation results of crosslinked polymers

Thermo-mechanical evaluation and life time simulation of high power LED lamp boards

Interfacial fracture toughness measurements in microelectronic packages with different test setups on samples from production

Assessment of thermo-mechanical stresses in Low Temperature Joining Technology

Thermal modelling and optimisation of hot solder dip process

Reliability and functionality investigation of CFRP embedded ultrasonic transducers supported by FEM and EFIT simulations

Modelling of temperature distribution in thermal microsensors on sandwich thermally isolated structures

Study of an active thermal recovery mechanism for an electrostatically actuated RF-MEMS switch

Experimental and numerical assessment of adhesion in real-life MEMS

Dynamic thermal simulation of high brightness LEDs with unsteady driver power output

A domain decomposition method for the simulation of fracture in polysilicon MEMS

Mechanical problems of novel back contact solar modules

Wafer level system packaging and integration for solid state lighting (SSL)

In-situ moisture desorption characterization of epoxy mold compound

Fracture toughness characterization and modeling of interfaces in microelectronic packages - A status review

Multi-physics simulation and reliability analysis for LED luminaires under step stress accelerated degradation test

Design of a 3-axis thermal accelerometer using an electro-thermo-fluidic model

A parametric multilevel MEMS simulation methodology using finite element method and mesh morphing

Accelerated testing method of LED luminaries

A multivariate parameter analysis of copper pillars eases the design of denser interconnects

FEM stress analysis in BGA components subjected to JEDEC drop test applying high strain rate lead-free solder material models

Simulation and qualification of a system-in-package (SiP) based solid state lighting (SSL) module

3D deformation FEM simulations and measurement during VDMOS transistor operation

Sintering process of silver nanoparticles in ink-jet printed conductive microstructures - Molecular dynamics approach

A comparison study of the prognostics approaches to Light Emitting Diodes under accelerated aging

The method of lines for the analysis of mechanical structures

Thermosonic flip-chip assembly on flex substrates

Characterisation of lead-free solders at high strain rates considering microstructural conditions

Cohesive zone model for delamination analysis of an embedded die system in package

Investigation of interface delamination in a SO8 package under reflow

Reliability modeling of electronic systems subjected to high strain rates

Interrogation of thermo-mechanical damage in field-deployed electronics

Simulation of diffusion controlled intermetallic formation of Au/Al interface

Electro-thermal simulation of a semiconductor power switch considering damage effects

Determination of interface fracture parameters by shear testing using different theoretical approaches

Nonlinear copper behavior of TSV and the cracking risks during BEoL-built-up for 3D-IC-integration

Measurement and simulation of moisture effects on electromagnetic radiation of printed circuit boards

Nonlinear analyses of semi-embedded through-silicon via (TSV) interposer with stress relief gap under thermal operating and environmental conditions

Thermal-mechanical responses of 3D IC integration with a passive TSV interposer

Numerical and experimental results correlation during power MOSFET ageing

Failure modeling of BGA package for reliability evaluation of handheld products under drop event

Simulation-based prediction of reliability and robustness of interconnect systems for semiconductor applications

Finite element modeling of solder joint fatigue in four-point bending test

Mechanical and tribological characterizations for reliability design of micromembranes

Consistent analytical model for single and dual thickness capacitive Micromachined Ultrasound Transducers (cMUT)

Studies on the transitional behaviors of Au-to-Au micro-contact during the initialization stage of contact formation under low contact force

A cost-effective active cooling method: Thermal performance and cost analysis

Thermal and moisture degradation in SSL system

Characterization of adhesives and interface strength for automotive applications

Polymer-based 2D/3D wafer level heterogeneous integration for SSL module

Thermal challenges in Photonic Integrated Circuits

Experimental assessment of flat-type photovoltaic module thermal behavior

Evaluation of adhesion strength of semiconductor package with the Weibull stress

Trends and challenges in lead free soldering

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)

EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems

2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007

EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems

EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005.

5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the

Evaluation of quasi-hermetic packaging solutions for active microwave devices and space applications

Content Provider	IEEE Xplore Digital Library
Author	Ben Naceur, W. Malbert, N. Labat, N. Fremont, H. Muraro, J.-L. Monfraix, P.
Copyright Year	2012
Description	Author affiliation: Thales Alenia Space, 26 Avenue J.F. Champollion, BP 33787, 31037 Toulouse Cedex 1, France (Muraro, J.-L.; Monfraix, P.) \|\| IMS Laboratory, University Bordeaux 1, 351 Cours de la Libération, 33405 Talence Cedex, France (Ben Naceur, W.; Malbert, N.; Labat, N.; Fremont, H.)
Abstract	A methodology is proposed to estimate the actual influence of important factors during steady-state Temperature Humidity Bias (THB) aging tests on SiN-passivated MMICs: temperature-humidity effects, bias conditions and protection by silica-filled epoxy resins dispensed by a dam-and-fill process. In this work, accelerated aging tests on microwave devices used for space applications were carried out, with or without bias. After 3000 hours of storage at 85°C/85%RH, there was no catastrophic failure. Only devices with PHEMT showed electrical degradations of some DC electrical parameters after 1000 hours of test. In another 1600 hours series of tests, bias parameter was added. Devices with PHEMT exhibited electrical breakdowns, especially under reverse biasing of the gate-source junction and before the required 1000 hours of test. The failed parts were localized by surface observation using optical and scanning electron microscopy. The failure electrical signatures were correlated by electrical simulations. In order to prepare future investigation on encapsulated devices, it was determined moisture diffusivity and content at saturation of commercial dam and fill resins. The actual protection time and the effects of bias conditions of encapsulated MMICs during THB tests were specified. These parameters can be taken into account for further analysis of the reliability of encapsulated active microwave devices for space applications.
File Size	1571661
File Format	PDF
ISBN	9781467315128
e-ISBN	9781467315135
DOI	10.1109/ESimE.2012.6191705
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-04-16
Publisher Place	Portugal
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	PHEMTs MESFETs Logic gates MMICs Humidity Monitoring Silicon compounds
Content Type	Text
Resource Type	Article

Central Library (ISO-9001:2015 Certified)
Indian Institute of Technology Kharagpur
Kharagpur, West Bengal, India | PIN - 721302

See location in the Map
03222 282435
Mail: support@ndl.gov.in

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in