NDLI: Studies on the transitional behaviors of Au-to-Au micro-contact during the initialization stage of contact formation under low contact force

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Studies on the transitional behaviors of Au-to-Au micro-contact during the initialization stage of contact formation under low contact force

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Studies on the transitional behaviors of Au-to-Au micro-contact during the initialization stage of contact formation under low contact force

Content Provider	IEEE Xplore Digital Library
Author	Haodong Qiu Hong Wang Feixiang Ke
Copyright Year	2012
Description	Author affiliation: Microelectronics Centre, School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore 639798, Republic of Singapore (Haodong Qiu; Hong Wang) \|\| Temasek Laboratories @ NTU, 50 Nanyang Drive, Research Techno Plaza, Singapore 637553, Republic of Singapore (Feixiang Ke)
Abstract	In nowadays, ohmic-contact MEMS switches have been widely studied due to their variously advantages, such as high isolation, low insertion loss, negligible power consumption and so on. The micro-contact behavior has been analyzed by several researchers using the conventional asperity deformation model, in which the electrical contact resistance decreases gradually with increasing contact force and finally reaches a saturation region. This paper presents a study of the instable region of micro-contact behaviors under low contact force and low current conditions, where the conventional model does not seems to be applicable. Random telegraph signals (RTS) were captured during the transition period before the establishment of stable electrical contact. An electrothermal approach was applied in our work and the time constants of the RTS during instable region are extracted statistically from the experimental data. The fundamental mechanism for the contact resistance instabilities were discussed under the framework of material transfer enhanced by localized Joule heating.
File Size	1067762
File Format	PDF
ISBN	9781467315128
e-ISBN	9781467315135
DOI	10.1109/ESimE.2012.6191804
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-04-16
Publisher Place	Portugal
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Switches Micromechanical devices Packaging Microwave technology
Content Type	Text
Resource Type	Article

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