NDLI: Thermal improvement of die attach with iodine treatment and its application in solid state lighting

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Thermal improvement of die attach with iodine treatment and its application in solid state lighting

Content Provider	IEEE Xplore Digital Library
Author	Kai Zhang Xinfeng Zhang Min Zhang Chen Yang Hongye Sun Yuen, M. Zhong, B. Bok, A.R. Liu, L. Cheuk Yan Chan Guoqi Zhang
Copyright Year	2012
Description	Author affiliation: Philips (China) Investment Co., Ltd, Philips Innovation Campus Shanghai No.2 Building, No.9, Lane 888, Tian Lin Road, 200233, China (Zhong, B.; Bok, A.R.; Liu, L.; Cheuk Yan Chan) \|\| Department of Mechanical Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, China (Kai Zhang; Xinfeng Zhang; Min Zhang; Chen Yang; Hongye Sun; Yuen, M.) \|\| Philips Lighting, Building EEA-208, Mathildelaan 1, 5611 BD Eindhoven, Netherlands (Guoqi Zhang)
Abstract	The mechanism of thermal conductivity enhancement of silver epoxy based die attach materials (DA) by iodine treatment is studied. Iodine treatment is found to be able to uniform the polymer network and accelerate the curing of die attach at relatively lower temperature with shorter curing duration. In addition, several metal halide salts are proved to have the same effect as the iodine treatment and be able to improve the conductivity of DA. The developed DA is applied in LED packages. The thermal performance of LED packages is evaluated to demonstrate the effect of iodine treatment of DA.
File Size	914458
File Format	PDF
ISBN	9781467315128
e-ISBN	9781467315135
DOI	10.1109/ESimE.2012.6191733
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-04-16
Publisher Place	Portugal
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Light emitting diodes Lead Polymers Packaging Thermal conductivity Voltage control Lighting
Content Type	Text
Resource Type	Article

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