NDLI: Prediction of wafer bow through thermomechanical simulation of patterned hard coated copper films

Content Provider	IEEE Xplore Digital Library
Author	Zarbakhsh, J. Detzel, T. Rui Huang Leicht, M. Nelle, P. Woehlert, S.
Copyright Year	2008
Description	Author affiliation: Kompetenzzentrum Automobil- und Ind.-Elektron. GmbH, Villach (Zarbakhsh, J.)
Abstract	Due to the large difference in the coefficients of thermal expansion of the materials used in advanced semiconductor manufacturing, the fabrication process of semiconductor chips leads to a wafer bow. In addition, the layers may pass through material phase changes, which generate an unwanted film stress, making the large accumulated wafer bow very difficult to handle. We have compared the wafer bow calculated from a thermomechanical finite element simulation with experiments, and developed new material models for copper and protecting layers. We have also shown how the patterning of the thin films reduces the overall wafer bow. The wafer bow has a linear dependency with respect to the coverage percentage, especially over the low coverage range. This study introduces useful hints and predicts a reduced wafer bow, which is already experimentally proved in the manufacturing process of a modern power semiconductor technology.
Starting Page	1
Ending Page	5
File Size	3353567
Page Count	5
File Format	PDF
ISBN	9781424421275
DOI	10.1109/ESIME.2008.4525036
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-04-20
Publisher Place	Germany
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thermomechanical processes Predictive models Copper Phase change materials Semiconductor films Semiconductor materials Manufacturing processes Thermal expansion Semiconductor device manufacture Fabrication hard protection power electronics wafer curvature technique wafer bow copper metallization finite element modeling material models Stoney’s formula Smart power devices passivation
Content Type	Text
Resource Type	Article

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