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Content Provider | IEEE Xplore Digital Library |
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Author | Chowdary, G. Neri, F. Somajayula, S. Notermans, G. |
Copyright Year | 2012 |
Description | Author affiliation: Aura Semiconductors, Bangalore, India (Chowdary, G.; Somajayula, S.) || Samsung Electronics, Suwon, South Korea (Neri, F.) || ST-Ericsson, Schlieren, Switzerland (Notermans, G.) |
Abstract | The thin gate oxide in nanoscale CMOS technologies is a serious challenge to the electrostatic discharge (ESD) robustness of ICs. This paper describes a sophisticated design solution for a 28V ESD clamp integrated in a 40nm CMOS product using only 2.75V transistors. It is suitable for I/O interface in SoC chips for mobile application and allows a battery charger to be connected directly to the chip. The presented clamp passed ESD/Latch-up test for HBM 3KV, 30V over-voltage test and 1000-hours prolonged operation life-time test. |
Starting Page | 1 |
Ending Page | 2 |
File Size | 317508 |
Page Count | 2 |
File Format | |
ISBN | 9781467356947 |
e-ISBN | 9781467356961 |
DOI | 10.1109/EDSSC.2012.6482885 |
Language | English |
Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher Date | 2012-12-03 |
Publisher Place | Thailand |
Access Restriction | Subscribed |
Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subject Keyword | Electrostatic discharges Clamps Logic gates CMOS integrated circuits Transistors CMOS technology System-on-chip 28V electrostatic discharge (ESD) on-chip ESD protection gate oxide over-stress Human-Body Model (HBM) 40nm CMOS |
Content Type | Text |
Resource Type | Article |
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