NDLI: Minimum Void Size and 3-Parameter Lognormal Distribution for EM Failures in Cu Interconnects

Content Provider	IEEE Xplore Digital Library
Author	Baozhen Li Christiansen, C. Gill, J. Filippi, R. Sullivan, T. Yashchin, E.
Copyright Year	2006
Description	Author affiliation: IBM Syst. & Technol. Group, Essex Junction, VT (Baozhen Li; Christiansen, C.; Gill, J.)
Abstract	Broad failure time distributions were observed for line depletion electromigration in Cu interconnects for various structures without sufficient liner contact and via redundancy. The root cause for this behavior was identified as the sensitivity of failure times to the void size, shape and location. Application of the traditional 2-parameter lognormal distribution model to corresponding stress data often results in very pessimistic EM lifetime projections. A 3-parameter lognormal distribution was found not only to fit the experimental data better, especially for the early portion of the failure time distributions, but also to generate more accurate lifetime projections for void-size-limited EM. Given the nature of EM wear-out, deeper consideration indicates that a 3-parameter lognormal distribution has a sounder physical basis than a 2-parameter lognormal distribution. The new parameter introduced in the model, the minimum failure time (X0 ), scales with via size over several technology generations, further validating the minimum void size explanation
Starting Page	115
Ending Page	122
File Size	497359
Page Count	8
File Format	PDF
ISBN	0780394984
DOI	10.1109/RELPHY.2006.251201
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-03-26
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Copper Integrated circuit interconnections Redundancy Stress Electromigration Aluminum Electrons Dielectric materials Shape Ultra large scale integration redundancy Cu interconnects voids reliability lognormal
Content Type	Text
Resource Type	Article

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