NDLI: 3DFFT: Thermal Analysis of Non-Homogeneous IC Using 3D FFT Green Function Method

Content Provider	IEEE Xplore Digital Library
Author	Dongkeun Oh Chung Ping Chen, C. Yu Hen Hu
Copyright Year	2007
Description	Author affiliation: Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI (Dongkeun Oh; Chung Ping Chen, C.; Yu Hen Hu)
Abstract	Due to the roaring power dissipation and gaining popularity of 3D integration, thermal dissipation has been a critical concern of modern VLSI design. The availability for chip-level 3D thermal analysis is crucial for thermal integrity analysis. In this paper, we formulated an analytical Green function solution of the 3D temperature distribution in a multi-layer integrated circuit substrate. The proposed analytical solution differs from the previously reported results in two ways: (a) This is a 3D temperature distribution solution, while only 2D solutions are reported in the past; and (b) a rectangular coordinate system is used rather than the cylindrical coordinates used in the past which leads to a more proper and accurate representation to the VLSI geometry. Experimental results demonstrate the speed advantage of our approach and the accuracy within the error 0.5% when compared with commercial computational fluid dynamics software ANSYS
Starting Page	567
Ending Page	572
File Size	480268
Page Count	6
File Format	PDF
ISBN	0769527957
DOI	10.1109/ISQED.2007.1
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-03-26
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Green function Temperature distribution Computational fluid dynamics Very large scale integration Thermal conductivity Poisson equations Power dissipation Geometry Integrated circuit modeling Finite element methods 3DFFT CAD Fourier Transform Thermal Modeling Green's Function Multi-layer Simulation
Content Type	Text
Resource Type	Article

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