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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Bohm, P. Wachutka, G. |
| Copyright Year | 2000 |
| Description | Author affiliation: Inst. for Phys. & Electrotechnol., Tech. Univ. Munchen, Germany (Bohm, P.) |
| Abstract | This article presents a new approach to the evaluation of the eigendynamics of interconnects encountered in high frequency power converters and high power semiconductor modules. It is based on a three-dimensional transient electromagnetic field analysis under realistic switching conditions which allows to investigate the various distributed parasitic effects caused by short switching times, steep current and voltage gradients and therefore large di/dt. The finite element simulator NM SESES/sup TM/ has been extended by an electromagnetic kernel to solve these problems. The capability of the simulator is demonstrated by some illustrative examples. |
| Starting Page | 303 |
| Ending Page | 307 |
| File Size | 462912 |
| Page Count | 5 |
| File Format | |
| ISBN | 0780362691 |
| ISSN | 10636854 |
| DOI | 10.1109/ISPSD.2000.856831 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2000-05-22 |
| Publisher Place | France |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Electromagnetic modeling Electromagnetic transients Transient analysis Power semiconductor switches Frequency conversion Electromagnetic fields Cause effect analysis Electromagnetic analysis Voltage Finite element methods |
| Content Type | Text |
| Resource Type | Article |
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