NDLI: Numerical analysis tool for transient skin effect problems

Content Provider	IEEE Xplore Digital Library
Author	Bohm, P. Wachutka, G.
Copyright Year	2004
Description	Author affiliation: Inst. for Phys. of Electrotechnol., Munich Univ. of Technol., Germany (Bohm, P.; Wachutka, G.)
Abstract	A new numerical analysis tool for the investigation of the three-dimensional transient electromagnetic behavior of interconnect structures in high power modules is presented. The simulator uses the finite element method to receive a continuous field description of electric and magnetic fields caused by bus bars under fast operating conditions and allows for a detailed investigation of distributed parasitic effects. Time dependent current crowding, time dependent inductances, overvoltage peaks or current turn-on delays can be determined. The finite element based concept permits to consider both voltage- and current-driven problems and is well suited to analyze complex plate structures, as no a priori decomposition of any conductor into partial elements is needed. The interconnect analysis tool was developed by the help of the object-oriented C++ library Diffpack, a software development framework for the solution of partial differential equations. The mixed finite element method is applied to solve the skin effect problem by a combination of a vector and a scalar potential. Edge finite elements are used to discretize the vector quantity. Re-using well-tested and efficient code of the library allows analyzing complex three-dimensional bus bar arrangements.
Sponsorship	IEEE Power Electon. Soc
Starting Page	880
Ending Page	884
File Size	394968
Page Count	5
File Format	PDF
ISBN	0780383990
ISSN	02759306
DOI	10.1109/PESC.2004.1355534
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-06-20
Publisher Place	Germany
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Numerical analysis Transient analysis Skin effect Finite element methods Electromagnetic transients Software libraries Multichip modules Object oriented modeling Bars Proximity effect
Content Type	Text
Resource Type	Article

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