NDLI: A Multilayer Ceramic Package For Silicon Micromachined Accelerometers

Content Provider	IEEE Xplore Digital Library
Author	Koen, E. Pourahmadi, F. Terry, S.
Copyright Year	1995
Description	Author affiliation: EG&G IC Sensors (Koen, E.)
Abstract	A novel ceramic package for a two-chip silicon accelerometer and the signal conditioning ASIC chip assembly has been developed with the advantage of being directly mounted on a PC board thus eliminating the need for additional mounting structures for automotive airbag applications. The hermetic package is designed to be mounted either in vertical or flat positions on a PC board, thus enabling the sensing directions of the accelerometer to be parallel or perpendicular to the plane of the PC board for front and side air bag applications. The package has been modeled for thermal stress induced during assembly and operating conditions. The dynamics of the package was determined using static, harmonic, modal, random vibration and transient dynamic modeling. Testing of the mounted package on the shaker shows flat frequency response to 4.5kHz. Temperature cycling on the unit between -40/spl deg/ and 85/spl deg/C shows no failures or performance degradation over 2400 temperature cycles.
Starting Page	273
Ending Page	276
File Size	577262
Page Count	4
File Format	PDF
ISBN	9163034735
DOI	10.1109/SENSOR.1995.717170
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1995-06-25
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Nonhomogeneous media Ceramics Silicon Accelerometers Electronics packaging Thermal stresses Application specific integrated circuits Assembly Automotive engineering Vehicle dynamics
Content Type	Text
Resource Type	Article

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