NDLI: Polysilicon Surface Modification Technique To Reduce Sticking Of Microstructures

Content Provider	IEEE Xplore Digital Library
Author	Youngjoo Yee Kukjin Chun Jong Duk Lee
Copyright Year	1995
Description	Author affiliation: Seoul National University (Youngjoo Yee)
Abstract	A new and simple surface modification technique is proposed to reduce sticking of microstructures fabricated by surface micromachining. This technique realizes very rugged surface at substrate polysilicon, resulting in reduced sticking through decrease of real contact area. The surface, which consists of honeycomb shaped grain holes at the substrate polysilicon layer, is defined by two-step dry etch without additional masking step for photolithography nor deposition of thin films. By varying the time for etching grain holes of substrate polysilicon, controlled surface roughness can be obtained. Test structures, including various length of polysilicon cantilever beams and micro bridges, fabricated by surface micromachining with proposed surface modification shows twice increase of detachment length without sticking to substrate.
Starting Page	206
Ending Page	209
File Size	701537
Page Count	4
File Format	PDF
ISBN	9163034735
DOI	10.1109/SENSOR.1995.717142
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1995-06-25
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Microstructure Rough surfaces Surface roughness Substrates Grain boundaries Dry etching Oxidation Micromachining Solids Lithography
Content Type	Text
Resource Type	Article

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