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Content Provider | IEEE Xplore Digital Library |
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Author | Jouppi, N.P. Boyle, P. Dion, J. Doherty, M.J. Eustace, A. Haddad, R. Mayo, R. Menon, S. Monier, L. Stark, D. Turrini, S. Yang, L. |
Copyright Year | 1993 |
Description | Author affiliation: Digital Equipment Corp., Palo Alto, CA, USA (Jouppi, N.P.; Boyle, P.; Dion, J.; Doherty, M.J.; Eustace, A.; Haddad, R.; Mayo, R.; Menon, S.; Monier, L.; Stark, D.; Turrini, S.; Yang, L.) |
Abstract | A full-custom 32-b ECL (emitter coupled logic) microprocessor which uses a 1.0- mu m-drawn single-poly technology with four layers of aluminum and one layer of gold interconnect is described. The 15.4-mm*12.6-mm die contains 468-k bipolar transistors (f/sub t/=13 GHz) and 206-k resistors. The chip implements a subset of an existing RISC (reduced instruction set computer) architecture. The machine has five pipeline stages, each one clock cycle long. A 128-b bus is used for incoming data; a 64-b bus is used for outgoing data. The chip uses a single-phase differential clock. The clock distribution network consists of three levels of H-trees. The 2-kB instruction and data caches use a 16-B line, contain byte parity, and are direct-mapped. The chip contains 30 internal master bias circuits, whose outputs are wire-ORed together. The logic portions of the chip primarily use a single-ended 575-mV swing. |
Starting Page | 84 |
Ending Page | 85 |
File Size | 595511 |
Page Count | 2 |
File Format | |
ISBN | 0780309871 |
DOI | 10.1109/ISSCC.1993.280074 |
Language | English |
Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher Date | 1993-02-24 |
Publisher Place | USA |
Access Restriction | Subscribed |
Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subject Keyword | Microprocessors Clocks Logic Aluminum Gold Integrated circuit interconnections Bipolar transistors Resistors Reduced instruction set computing Computer aided instruction |
Content Type | Text |
Resource Type | Article |
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