NDLI: TIM selection criteria for silicon validation environment

Content Provider	IEEE Xplore Digital Library
Author	Ying Feng Pang Mohammed, R.K. Sahan, R.A. Yi Xia Prabhugoud, M.
Copyright Year	2010
Description	Author affiliation: Platform Validation Eng., Intel Corp., Santa Clara, CA, USA (Ying Feng Pang; Mohammed, R.K.; Sahan, R.A.; Yi Xia; Prabhugoud, M.)
Abstract	Thermal interface materials (TIMs) are widely used as heat conductive medium between a heat source and a heat dissipating device. A high thermal performance TIM can provide a low thermal resistance path and thus improve the thermal management of the heat source. This paper presents various criteria for TIMs used in silicon validation environment in addition to the well-known criteria for high performance TIMs. Seven commercially available greases and eight different thermal pads were evaluated based on the requirements for use in the silicon validation environment. These criteria include thermal performance before and after subjected to elevated temperature, adhesiveness of the grease before and after subjected to elevated temperature, adhesiveness of the grease over multiple usages, compliance of the thermal pad, reusability of the thermal pad for multiple loading and unloading cycles, and severity of silicone bleed from the thermal pad under elevated temperature and pressure. In addition to these validation requirements of TIMs, there is an additional requirement of high cycle of reusability in the robotic testing environment to minimize human interface. Indium TIM, a metallic TIM, provides well over 500 reusability cycles. Adhesion issue with high Indium content becomes dominant at high temperature and needs to be well addressed to take advantage of the reusability characteristics of Indium TIM.
Starting Page	107
Ending Page	114
File Size	2228684
Page Count	8
File Format	PDF
ISBN	9781424494583
ISSN	10652221
e-ISBN	9781424494606
e-ISBN	9781424494613
DOI	10.1109/STHERM.2010.5444307
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-02-21
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Silicon Thermal management Thermal resistance Thermal loading Temperature Indium Thermal conductivity Conducting materials Immune system Resistance heating heatsink Thermal interface material thermal performance CPU chipset validation grease thermal pad
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Highly reliable silicone TIM for CPU package - Silicone curable grease -

High performance air-cooled temperature margining thermal tools for silicon validation

High-performance carbon nanotubes thermal interface materials

New developments for a no-pump-out high-performance thermal grease

Efficient method for characterization of various thermal interface materials

Modeling heat transport in thermal interface materials enhanced with MEMS based microinterconnects

High-performance thermal interface technology overview

Technical review of characterization methods for thermal interface Materials (TIM)

Low melting point thermal interface material

TIM selection criteria for silicon validation environment

Similar Documents

Highly reliable silicone TIM for CPU package - Silicone curable grease -

High performance air-cooled temperature margining thermal tools for silicon validation

High-performance carbon nanotubes thermal interface materials

New developments for a no-pump-out high-performance thermal grease

Efficient method for characterization of various thermal interface materials

Modeling heat transport in thermal interface materials enhanced with MEMS based microinterconnects

High-performance thermal interface technology overview

Technical review of characterization methods for thermal interface Materials (TIM)

Low melting point thermal interface material

TIM selection criteria for silicon validation environment