NDLI: Thermo-mechanical simulative study for 3D vertical stacked IC packages with spacer structures

Content Provider	IEEE Xplore Digital Library
Author	Ming-Che Hsieh Chih-Kuang Yu Sheng-Tsai Wu
Copyright Year	2010
Description	Author affiliation: EOL/Ind. Technol. Res. Inst., Hsinchu, Taiwan (Ming-Che Hsieh; Chih-Kuang Yu; Sheng-Tsai Wu)
Abstract	As the market demands for high performance, miniaturized, better reliability and lower-priced portable electronic products, the integration of a system into three-dimensional (3D) chip stacking packages are presently used to achieve these targets. Even though the miniaturization of system scaling, low power consumption and better electrical performance can be performed by 3DIC packaging technologies, thermo-mechanical problems occur due to the 3D stacking feature. Because dice are vertically stacked in 3DIC packages, higher junction temperature as well as temperature concentration phenomenon inside the stacking dice are resulted in and cause larger corresponding thermal induced stresses. Hence, the problems of heat dissipation and thermal induced stresses always cause failures or fatigues in 3D stacked IC packages and become critical reliability issues. In order to realize thermo-mechanical coupling effects in 3D vertical stacked IC packages with spacer structures, four layer vertical stacked dice (bare die to bare die) with TSV (through-silicon-via), metal bumps, and spacer structures are constructed as the test vehicle. In the thermo-mechanical coupling simulative study, the accurate convection heat transfer coefficients that obtained from computational fluid dynamics technique are used as the applied boundary conditions in finite element analysis (FEA) modeling to obtain precisely thermal stress distributions. Therefore, not only the temperature distributions and thermal characteristics (thermal resistance and junction temperature) can be resolved but also the corresponding precisely thermal stress distributions can be illustrated by using FEA. These results can be most effectively used as design guidelines to engineers if thermo-mechanical coupling solutions for 3D vertical stacked IC package with the conditions of dice powered on are required.
Starting Page	47
Ending Page	54
File Size	1200270
Page Count	8
File Format	PDF
ISBN	9781424494583
ISSN	10652221
e-ISBN	9781424494606
e-ISBN	9781424494613
DOI	10.1109/STHERM.2010.5444314
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-02-21
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thermomechanical processes Integrated circuit packaging Thermal stresses Electronic packaging thermal management Thermal resistance Stacking Temperature distribution Power system reliability Consumer electronics Energy consumption FEA 3DIC TSV Thermal Resistance Thermal Stress Spacer
Content Type	Text
Resource Type	Article

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